Client: RS Components
Application: Conductive packaging trays for IC carriers
Status: Production-ready – Full tray range transitioned
Product Information: CNX 400.00
RS Components partnered with Chestnut Biopolymers to develop a biodegradable alternative to conductive polypropylene used in their automated IC carrier packaging system. The project presented a dual challenge: the material had to meet precise ISO defined conductivity thresholds while also delivering tight dimensional tolerances for automated sorting and packing lines.
We conducted an extensive formulation campaign, iterating through a series of biopolymer blends that integrated conductive additives without compromising moulding performance. After rigorous lab validation of surface resistivity, tensile properties, and flow behaviour, we selected a formulation that met both electrostatic discharge (ESD) requirements and tight tolerance moulding specifications.
Initial trials were conducted with RS’s incumbent moulder, successfully replicating three of the four carrier sizes. The smallest tray, however, failed due to deterioration in 15-year-old tooling. With the supplier winding down injection moulding operations, Chestnut facilitated the transfer of tooling and collaboration with McLaren Plastics—a UK-based moulder experienced in high-precision biopolymer processing. Together, we co-developed a new hot-runner mould tailored for our material.
All four tray designs are now in production at McLaren, and a long-term supply agreement is in place. RS Components can now maintain automation precision while transitioning to sustainable, biodegradable packaging that meets stringent functional and regulatory demands.